DRA829JMTGBALFR - Texas Instruments

DRA829JMTGBALFR Details

• Manufacturer Part Number:

  DRA829JMTGBALFR

• Brand Name:

  Texas Instruments

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Country Of Origin:

  South Korea

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.50

• Manufacturer:

  Texas Instruments

• YTEOL:

  0

• Bit Size:

  64

• Boundary Scan:

  YES

• Clock Frequency-Max:

  27 MHz

• External Data Bus Width:

  32

• Format:

  FIXED POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B827

• JESD-609 Code:

  e1

• Length:

  24 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of External Interrupts:

  1

• Number of Serial I/Os:

  31

• Number of Terminals:

  827

• On Chip Data RAM Width:

  8

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA827,29X29,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  250

• RAM (words):

  9961472

• Screening Level:

  AEC-Q100; ISO 26262-ASIL D

• Seated Height-Max:

  2.8 mm

• Speed:

  2000 MHz

• Supply Voltage-Max:

  0.84 V

• Supply Voltage-Min:

  0.76 V

• Supply Voltage-Nom:

  0.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Width:

  24 mm

• uPs/uCs/Peripheral ICs Type:

  SoC