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DRC2143X0L - Panasonic

Description: DRC2143X0L, Digital Transistor, NPN 100 MA 50 V 4.7 kΩ, Ratio Of 0.47, 3-Pin Mini3 G3 B

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PCB Footprints
DRC2143X0L - Panasonic PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - Mini3-G3-B
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3D Models
DRC2143X0L - Panasonic  - 3D model - SOT23 (3-Pin) - Mini3-G3-B
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DRC2143X0L Details

  • Manufacturer Part Number:

    DRC2143X0L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, MINI3-G3-B, SC-59A, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Panasonic Electronic Components

  • Additional Feature:

    BUILT IN BIAS RESISTOR RATIO IS 2.13

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    30

  • JEDEC-95 Code:

    TO-236AA

  • JESD-30 Code:

    R-PDSO-G3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DRC2143X0L Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise and crosstalk.
  • Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking airflow to the device. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • A 10uF to 22uF ceramic capacitor with a voltage rating of 25V or higher is recommended. The capacitor should be placed as close to the VIN pin as possible.
  • Use an oscilloscope to check the input and output voltage waveforms, and a thermal camera to check for hotspots. Check the PCB layout for any errors or omissions, and ensure that the device is properly soldered and connected.
  • Yes, but ensure that the device is used within its specified operating conditions and that the system is designed with adequate safety margins. Also, consider using redundant or fault-tolerant designs to ensure system reliability.

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