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DS1037-01-25FNAKSI74 - Connfly

Description: D-Sub; PIN: 25; socket; female; angled 90°; THT; UNC 4-40; -55÷105°C

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DS1037-01-25FNAKSI74 Details

  • Manufacturer Part Number:

    DS1037-01-25FNAKSI74

  • Part Life Cycle Code:

    Contact Manufacturer

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Manufacturer:

    Ningbo connfly electronic CO LTD

  • Board Mounting Option:

    SPLIT BOARD LOCK

  • Body Breadth:

    0.492 inch

  • Body Depth:

    0.565 inch

  • Body Length:

    2.09 inch

  • Connector Type:

    D SUBMINIATURE CONNECTOR

  • Contact Gender:

    FEMALE

  • Contact Pattern:

    STAGGERED

  • Contact Resistance:

    20 mΩ

  • Contact Style:

    RND PIN-SKT

  • Dielectric Withstanding Voltage:

    700VAC V

  • Empty Shell:

    NO

  • Filter Feature:

    NO

  • Insulation Resistance:

    1000000000 Ω

  • Insulator Color:

    BLACK

  • Insulator Material:

    GLASS FILLED POLYBUTYLENE TEREPHTHALATE

  • Mating Contact Pitch:

    0.109 inch

  • Mating Contact Row Spacing:

    0.112 inch

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    HOLE .189

  • Mounting Option 2:

    SCREW

  • Mounting Style:

    RIGHT ANGLE

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number Of PCB Rows:

    2

  • Number of Rows Loaded:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Option:

    GENERAL PURPOSE

  • PCB Contact Pattern:

    STAGGERED

  • PCB Contact Row Spacing:

    2.84 mm

  • Plating Thickness:

    FLASH inch

  • Rated Current (Signal):

    3 A

  • Shell Material:

    STEEL

  • Shell Size:

    3/B

  • Terminal Length:

    0.173 inch

  • Terminal Pitch:

    2.77 mm

  • Termination Type:

    SOLDER

  • Total Number of Contacts:

    25

DS1037-01-25FNAKSI74 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the DS1037-01-25FNAKSI74 is -40°C to 125°C, as specified in the datasheet.
  • To ensure reliability in high-vibration environments, it's recommended to follow proper mounting and soldering techniques, and consider using additional mechanical support or potting compounds to secure the device.
  • The maximum power dissipation of the DS1037-01-25FNAKSI74 is not explicitly stated in the datasheet, but it can be calculated based on the device's thermal resistance and maximum junction temperature. It's recommended to consult with the manufacturer or a thermal expert for specific guidance.
  • The DS1037-01-25FNAKSI74 is not hermetically sealed, so it's not recommended for use in humid or moist environments without proper protection. Consider using conformal coating, potting, or other environmental protection methods to ensure reliability.
  • The typical lead time for delivery of the DS1037-01-25FNAKSI74 varies depending on the manufacturer's production schedule, inventory levels, and shipping logistics. It's recommended to contact the manufacturer or a authorized distributor for the most up-to-date lead time information.

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DS1037-01-25FNAKSI74 Overview

Use the download button to access the DS1037-01-25FNAKSI74 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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