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DS10BR150TSD/NOPB - Texas Instruments

Description: Texas Instruments DS10BR150TSD/NOPB, LVDS Buffer & Repeater Combination, 8-Pin LLP

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DS10BR150TSD/NOPB - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - WSON-8
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3D Models
DS10BR150TSD/NOPB - Texas Instruments  - 3D model - Small Outline No-lead - WSON-8
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DS10BR150TSD/NOPB Details

  • Manufacturer Part Number:

    DS10BR150TSD/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    WSON-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    S-PQCC-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.25 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    SOLCC8,.11,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    0.6 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    21 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    0.6 ns

  • Width:

    3 mm

DS10BR150TSD/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the DS10BR150TSD/NOPB involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • Proper termination for the DS10BR150TSD/NOPB involves using a combination of series and parallel termination resistors to match the impedance of the transmission line. The datasheet provides guidelines for termination, but additional simulation and testing may be required for optimal performance.
  • The DS10BR150TSD/NOPB requires a specific power sequencing to prevent damage to the device. The recommended power-up sequence is to apply VCC first, followed by VCCA, and then the input signals. The power-down sequence should be reversed.
  • The DS10BR150TSD/NOPB has a high power dissipation, so thermal management is critical. A heat sink or thermal pad can be used to dissipate heat, and the device should be placed in a well-ventilated area. The PCB should also be designed to minimize thermal resistance.
  • The DS10BR150TSD/NOPB has built-in ESD protection, but additional protection may be required depending on the application. It is recommended to use ESD protection devices, such as TVS diodes, to protect the device from electrostatic discharge.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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