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DS10CP152TMAX/NOPB - Texas Instruments

Description: 1.5-Gbps 2x2 LVDS crosspoint switch

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DS10CP152TMAX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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DS10CP152TMAX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16)
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DS10CP152TMAX/NOPB Details

  • Manufacturer Part Number:

    DS10CP152TMAX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    CROSS POINT SWITCH

  • Input Voltage-Max:

    1 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.58 mm

  • Supply Current-Max (Isup):

    70 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-on Time-Max:

    20000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.91 mm

DS10CP152TMAX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the signal traces as short as possible. Additionally, it's recommended to use a 50-ohm transmission line impedance and to avoid vias and stubs in the signal path.
  • To ensure reliable operation in high-temperature environments, it's recommended to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and keeping the device within its specified operating temperature range.
  • When using the DS10CP152TMAX/NOPB in a system with multiple clock domains, it's essential to ensure that the clock signals are properly synchronized and that the device is configured to handle the clock domain crossings. This may require additional circuitry or logic to ensure reliable operation.
  • To troubleshoot issues with the DS10CP152TMAX/NOPB, it's recommended to use oscilloscopes and other test equipment to analyze the signal waveforms and jitter. Additionally, checking the device's configuration and setup, as well as the PCB layout and signal routing, can help identify and resolve issues.
  • Yes, when using the DS10CP152TMAX/NOPB, it's essential to follow proper EMI/EMC design practices, such as using shielding, filtering, and grounding techniques to minimize electromagnetic interference and ensure compliance with relevant standards.

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DS10CP152TMAX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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