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DS1245Y-70+ - Analog Devices

Description: Maxim DS1245Y-70+ NVRAM, 1Mbit, 70ns, 5V 32-Pin EDIP

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DS1245Y-70+ - Analog Devices PCB footprint - Dual-In-Line Sockets - Dual-In-Line Sockets - DS1245Y-70+
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DS1245Y-70+ Details

  • Manufacturer Part Number:

    DS1245Y-70+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    N/A

  • Package Description:

    0.740 INCH, ROHS COMPLIANT, DIP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Date Of Intro:

    2002-10-30

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Access Time-Max:

    70 ns

  • JESD-30 Code:

    R-XDIP-P32

  • JESD-609 Code:

    e3

  • Length:

    43.053 mm

  • Memory Density:

    1048576 bit

  • Memory IC Type:

    NON-VOLATILE SRAM MODULE

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    128KX8

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP32,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.922 mm

  • Standby Current-Max:

    0.0006 A

  • Supply Current-Max:

    0.085 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    PIN/PEG

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

DS1245Y-70+ Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCC first, followed by VEE, and then the input signals. This ensures proper device operation and prevents latch-up.
  • The thermal shutdown feature is designed to protect the device from overheating. If the device exceeds the maximum junction temperature, it will shut down. To handle this, ensure proper heat sinking, reduce power consumption, and avoid operating the device in high-temperature environments.
  • The maximum capacitive load that the DS1245Y-70+ can drive is 100 pF. Exceeding this limit may cause oscillations or instability in the output signal.
  • No, the DS1245Y-70+ is not designed for radiation-hardened applications. It does not meet the requirements for total ionizing dose (TID) or single-event effects (SEE). For radiation-hardened applications, consider using a different device or consulting with Analog Devices Inc for a custom solution.
  • To ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding or filtering components. Additionally, ensure that the device is operated within its specified frequency range and that the input and output signals are properly terminated.

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DS1245Y-70+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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For a full list of alternate parts for DS1245Y-70+, check out Findchips.com