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DS15BA101SDE/NOPB - Texas Instruments

Description: Texas Instruments DS15BA101SDE/NOPB, LVDS Buffer CML/ LVDS/ LVPECL 2Gbit/s, 8-Pin, LLP

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DS15BA101SDE/NOPB - Texas Instruments - PCB symbol
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PCB Footprints
DS15BA101SDE/NOPB - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - NGQ0008A
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3D Models
DS15BA101SDE/NOPB - Texas Instruments - 3D model - Small Outline No-lead - NGQ0008A
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DS15BA101SDE/NOPB Details

  • Manufacturer Part Number:

    DS15BA101SDE/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SON

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    BUFFER

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    49 mA

  • Supply Voltage Limit-Max:

    3.6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

DS15BA101SDE/NOPB Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power planes. Use a common mode choke or a ferrite bead to filter the power supply.
  • Ensure that the device is properly heatsinked, and the PCB is designed to minimize thermal gradients. Use a thermal interface material to improve heat transfer between the device and the heatsink.
  • Not using the recommended input capacitance may result in reduced noise immunity, increased jitter, and decreased signal integrity. It may also affect the device's ability to meet the specified rise and fall times.
  • While the device can operate with input voltages between 2.5V and 3.6V, the recommended operating voltage is 3.3V. Operating at a different voltage may affect the device's performance, power consumption, and reliability.
  • Use an oscilloscope to measure the signal waveform and jitter. Check the PCB layout, signal routing, and termination. Verify that the input signal meets the recommended specifications. Consult the datasheet and application notes for guidance on signal integrity and jitter reduction.

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DS15BA101SDE/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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