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DS25BR150TSD/NOPB - Texas Instruments

Description: 3.125 Gbps LVDS Buffer

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DS25BR150TSD/NOPB - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - NGQ0008A
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3D Models
DS25BR150TSD/NOPB - Texas Instruments  - 3D model - Small Outline No-lead - NGQ0008A
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DS25BR150TSD/NOPB Details

  • Manufacturer Part Number:

    DS25BR150TSD/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    WSON-8

  • Pin Count:

    8

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    S-XDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.25 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.11,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    35 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    0.465 ns

  • Width:

    3 mm

DS25BR150TSD/NOPB Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (–40°C to 125°C). Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device.
  • The maximum current rating for the DS25BR150TSD/NOPB is 1.5 A. However, the actual current handling capability may be limited by the PCB layout, thermal design, and operating conditions.
  • Yes, the DS25BR150TSD/NOPB is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q100 and is manufactured using a qualified process.
  • The DS25BR150TSD/NOPB has built-in ESD protection. However, it is still recommended to follow proper ESD handling procedures during assembly and testing to prevent damage.

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DS25BR150TSD/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image DS25BR150TSD Texas Instruments

Line Driver, 1 Func, 1 Driver, BICMOS, DSO8