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DS72060W200FPV - Renesas Electronics

Description: The SH7206 is a set of ROMless products with a maximum operating frequency of 200MHz. With 128 Kbytes of on-chip RAM to which both read and write accesses can be accomplished in a single clock cycle, the SH7206 maximizes the performance of 200 MHz operating frequency. Equipped with fast external Bus Clock that operates at a maximum frequency of 66MHz and Bus Interface Control Circuit, the SH7206 can be directly connected to various external devices without the need of glue logic. The SH7206 includes industr

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DS72060W200FPV - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - FP-176CV
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DS72060W200FPV - Renesas Electronics  - 3D model - Quad Flat Packages - FP-176CV
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DS72060W200FPV Details

  • Manufacturer Part Number:

    DS72060W200FPV

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LQFP

  • Package Description:

    24 X 24 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, LFQFP-176

  • Pin Count:

    176

  • Manufacturer Package Code:

    PLQP0176KD

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES MINI SUPPLY 4V AT 16 MHZ

  • Address Bus Width:

    26

  • Bit Size:

    32

  • Clock Frequency-Max:

    66.67 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G176

  • Length:

    24 mm

  • Number of I/O Lines:

    78

  • Number of Terminals:

    176

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.7 mm

  • Speed:

    200 MHz

  • Supply Voltage-Max:

    1.35 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.25 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    24 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

DS72060W200FPV Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients. Also, consider using thermal protection circuits and over-temperature shutdown mechanisms.
  • The critical timing parameters include the clock frequency, setup and hold times, and rise and fall times for the interfaces such as SPI, I2C, and UART. Refer to the datasheet for specific values and ensure that the system design meets these requirements.
  • The device requires a specific power sequencing and voltage ramp-up/ramp-down sequence to ensure reliable operation. Refer to the datasheet for the recommended power-up and power-down sequences, and ensure that the power supply design meets these requirements.
  • The device has built-in ESD protection, but additional external protection measures such as TVS diodes and resistors may be required depending on the system design. Latch-up prevention measures include using a latch-up immune design and following the recommended PCB layout guidelines.

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