Description:The SH7619 Group is supported only for customers who have already adopted these products. The RX Family or RZ Family are recommended for new designs.
16 KILOBYTES OF U MEMORY, 2 KILOBYTES OF BUFFER RAM
Address Bus Width:
26
Bit Size:
32
Boundary Scan:
YES
CPU Family:
SUPERH
Clock Frequency-Max:
25 MHz
DAC Channels:
NO
DMA Channels:
YES
External Data Bus Width:
32
Format:
FIXED POINT
Integrated Cache:
YES
JESD-30 Code:
S-PBGA-B176
Length:
13 mm
Low Power Mode:
YES
Number of DMA Channels:
4
Number of External Interrupts:
9
Number of I/O Lines:
78
Number of Serial I/Os:
4
Number of Terminals:
176
Number of Timers:
1
Operating Temperature-Max:
70 °C
Operating Temperature-Min:
-20 °C
PWM Channels:
NO
Package Body Material:
PLASTIC/EPOXY
Package Code:
LFBGA
Package Equivalence Code:
BGA176,15X15,32
Package Shape:
SQUARE
Package Style:
GRID ARRAY, LOW PROFILE, FINE PITCH
ROM (words):
0
Seated Height-Max:
1.4 mm
Speed:
125 MHz
Supply Current-Max:
300 mA
Supply Voltage-Max:
1.89 V
Supply Voltage-Min:
1.71 V
Supply Voltage-Nom:
1.8 V
Surface Mount:
YES
Technology:
CMOS
Terminal Form:
BALL
Terminal Pitch:
0.8 mm
Terminal Position:
BOTTOM
Width:
13 mm
uPs/uCs/Peripheral ICs Type:
MICROCONTROLLER, RISC
DS76191B125BGV Frequently Asked Questions (FAQs)
Renesas provides a recommended PCB layout guide in their application note (APL-AN-114) for thermal management. It suggests using a 4-layer PCB with a thermal relief pattern, and placing thermal vias under the package to improve heat dissipation.
To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a heat sink or thermal management system, and consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
The datasheet recommends using a low-ESR ceramic capacitor (CIN) with a value between 1-10uF, and a high-quality, low-ESR output capacitor (COUT) with a value between 10-22uF. The capacitor selection should be based on the specific application requirements and operating conditions.
To troubleshoot POR issues, check the power supply voltage, ensure the input voltage is within the recommended range, and verify the POR timing is within the specified limits. Also, check for any noise or glitches on the power supply lines that might affect the POR circuitry.
To minimize EMC and EMI issues, follow proper PCB layout and design guidelines, use shielding and filtering components, and ensure the device is operated within the recommended frequency range. Additionally, consider using a common-mode choke or ferrite bead to reduce EMI emissions.
Trust Checks
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Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
DS76191B125BGV Overview
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