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DS76191N125BGV - Renesas Electronics

Description: The SH7619 Group is supported only for customers who have already adopted these products. The RX Family or RZ Family are recommended for new designs.

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DS76191N125BGV - Renesas Electronics PCB footprint - BGA - BGA - P-LFBGA176-13X13-0.80
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DS76191N125BGV - Renesas Electronics  - 3D model - BGA - P-LFBGA176-13X13-0.80
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DS76191N125BGV Details

  • Manufacturer Part Number:

    DS76191N125BGV

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    LFBGA

  • Package Description:

    LFBGA-176

  • Pin Count:

    176

  • Manufacturer Package Code:

    PLBG0176GA

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    NO

  • Additional Feature:

    16 KILOBYTES OF U MEMORY, 2 KILOBYTES OF BUFFER RAM

  • Address Bus Width:

    26

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    SUPERH

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B176

  • Length:

    13 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    4

  • Number of External Interrupts:

    9

  • Number of I/O Lines:

    78

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    176

  • Number of Timers:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA176,15X15,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • ROM (words):

    0

  • Seated Height-Max:

    1.4 mm

  • Speed:

    125 MHz

  • Supply Current-Max:

    300 mA

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

DS76191N125BGV Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes thermal design considerations, such as thermal vias, copper pours, and component placement. It's essential to follow these guidelines to ensure optimal thermal performance and prevent overheating.
  • The DS76191N125BGV has an internal overcurrent protection (OCP) feature, but it's not enabled by default. To implement OCP, you need to connect an external resistor (R_OCP) between the OCP pin and GND, and set the OCP threshold using the I2C interface. Refer to the datasheet and application notes for specific implementation details.
  • The maximum allowed voltage on the VCC pin during power-up and power-down sequences is 4.5V. Exceeding this voltage may cause damage to the device. It's essential to ensure that the power supply voltage ramps up and down slowly and within the specified limits to prevent damage.
  • To troubleshoot I2C interface issues, start by verifying the I2C bus voltage levels, clock frequency, and signal integrity. Use an oscilloscope or logic analyzer to monitor the SCL and SDA lines. Check for bus contention, clock stretching, and acknowledge errors. Also, ensure that the I2C slave address is correctly set and that there are no conflicts with other devices on the bus.
  • The recommended operating temperature range for the DS76191N125BGV is -40°C to 125°C. However, the device can operate up to 150°C for short periods during power-up and power-down sequences. It's essential to ensure that the device operates within the recommended temperature range to maintain reliability and prevent thermal damage.

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DS76191N125BGV Overview

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