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DS90CP22M-8 - Texas Instruments

Description: 800MBIT 2X2 LVDS SWITCH, DS90CP22M-8

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DS90CP22M-8 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - d(r-pdso-g16)
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3D Models
DS90CP22M-8 - Texas Instruments  - 3D model - Small Outline Packages - d(r-pdso-g16)
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DS90CP22M-8 Details

  • Manufacturer Part Number:

    DS90CP22M-8

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    CROSS POINT SWITCH

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e0

  • Length:

    9.902 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.753 mm

  • Supply Current-Max (Isup):

    125 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    4.5 ns

  • Switch-on Time-Max:

    55 ns

  • Switching:

    MAKE-BEFORE-BREAK

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    3.9 mm

DS90CP22M-8 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DS90CP22M-8 evaluation module (EVM) user's guide, which includes guidelines for component placement, routing, and thermal management.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
  • The maximum cable length supported by the DS90CP22M-8 depends on the specific application and the type of cable used. However, as a general guideline, Texas Instruments recommends keeping the cable length below 10 meters to ensure reliable operation.
  • The DS90CP22M-8 is designed to support the standard FPD-Link III protocol, but it may be possible to use it with a non-standard protocol with some modifications. However, this would require custom development and testing, and Texas Instruments may not provide support for such configurations.
  • Texas Instruments provides a range of tools and resources to help troubleshoot issues with the DS90CP22M-8, including application notes, user guides, and technical support. Engineers can also use oscilloscopes and other test equipment to debug the signal integrity and data transmission.

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DS90CP22M-8 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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