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DSC5002R0L - Panasonic

Description: DSC5002R0L, NPN Bipolar Transistor, 500 mA 50 V HFE:120 160 MHz, 3-Pin SMini3 F2 B

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Symbol
DSC5002R0L - Panasonic - PCB symbol
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PCB Footprints
DSC5002R0L - Panasonic PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SMini3-F2-B
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3D Models
DSC5002R0L - Panasonic - 3D model - SO Transistor Flat Lead - SMini3-F2-B
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DSC5002R0L Details

  • Manufacturer Part Number:

    DSC5002R0L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, SMINI3-F2-B, SC-85, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Panasonic Electronic Components

  • Collector Current-Max (IC):

    0.5 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    120

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    160 MHz

DSC5002R0L Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • Handle the device by the body, avoiding touching the pins or leads. Use an anti-static wrist strap or mat to prevent electrostatic discharge. Avoid bending or flexing the leads, and use a vacuum pick-up tool to handle the device.
  • Use thermal simulation software or consult with a thermal expert to determine the optimal heat sink size and design based on the device's power dissipation, ambient temperature, and airflow conditions.
  • The DSC5002R0L is designed to meet the reliability and durability requirements of automotive and industrial applications, with a typical lifespan of 10-15 years or more, depending on the operating conditions and usage.

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DSC5002R0L Overview

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