DSPB56374AE - NXP

DSPB56374AE Details

• Manufacturer Part Number:

  DSPB56374AE

• Rohs Code:

  Yes

• Part Life Cycle Code:

  End Of Life

• Package Description:

  10 X 10 MM, 1.40 MM HEIGHT, 0.65 MM PITCH, ROHS COMPLIANT, LQFP-52

• Country Of Origin:

  Mainland China, Malaysia

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  18 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Barrel Shifter:

  YES

• Bit Size:

  24

• Boundary Scan:

  YES

• Clock Frequency-Max:

  149.9 MHz

• Format:

  FIXED POINT

• Internal Bus Architecture:

  MULTIPLE

• JESD-30 Code:

  S-PQFP-G52

• JESD-609 Code:

  e3

• Length:

  10 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  52

• Operating Temperature-Max:

  110 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LQFP

• Package Shape:

  SQUARE

• Package Style:

  FLATPACK, LOW PROFILE

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.7 mm

• Supply Voltage-Max:

  1.3 V

• Supply Voltage-Min:

  1.2 V

• Supply Voltage-Nom:

  1.25 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  10 mm

• uPs/uCs/Peripheral ICs Type:

  DIGITAL SIGNAL PROCESSOR, OTHER