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DSPIC30F2012-20I/SP - Microchip

Description: DSPIC30F2012-20I/SP, 16 bit PIC Microcontroller 25MHz 12 kB Flash, 1024 B RAM, I2C 28-Pin SPDIP

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DSPIC30F2012-20I/SP - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 28-Lead Skinny Plastic Dual In-Line (SP) - 300mil Body [PDIP]
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DSPIC30F2012-20I/SP - Microchip  - 3D model - Dual-In-Line Packages - 28-Lead Skinny Plastic Dual In-Line (SP) - 300mil Body [PDIP]
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DSPIC30F2012-20I/SP Details

  • Manufacturer Part Number:

    DSPIC30F2012-20I/SP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    SPDIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SPDIP-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    40 MHz

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    R-PDIP-T28

  • JESD-609 Code:

    e3

  • Length:

    34.671 mm

  • Low Power Mode:

    YES

  • Number of External Interrupts:

    3

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    28

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • RAM (words):

    1024

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    140 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, CONTROLLER

DSPIC30F2012-20I/SP Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be used with the internal oscillator is 7.37 MHz (FRC oscillator) or 31.25 kHz (LPRC oscillator). However, the device can be clocked up to 40 MIPS using an external oscillator or clock source.
  • To configure the oscillator for optimal performance, set the FOSC configuration bits (FOSC<2:0>) in the Configuration Word 1 (CONFIG1) to select the desired oscillator mode. Additionally, ensure that the oscillator start-up timer (OST) is enabled to allow the oscillator to stabilize before the device starts executing code.
  • The maximum amount of current that can be sourced or sunk by the I/O pins is 25 mA per pin, with a total current limit of 200 mA for all I/O pins combined.
  • To implement a watchdog timer, enable the WDT by setting the SWDTEN bit in the RCON register. Then, configure the WDT period using the WDTPS bits in the WDTCON register. The WDT can be cleared using the CLR bit in the WDTCON register or by executing a CLR instruction.
  • The Brown-out Reset (BOR) feature is used to reset the device when the supply voltage falls below a certain threshold (typically 2.2V). This helps prevent the device from operating erratically or unpredictably during power-on or power-down sequences.

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DSPIC30F2012-20I/SP Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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