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DSPIC33CK32MC105-E/PT - Microchip

Description: Digital Signal Processors & Controllers - DSP, DSC dsPIC33C 100MHz, 32K Flash, 8K RAM, OpAmps, 12bit ADCs, PWM

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PCB Footprints
DSPIC33CK32MC105-E/PT - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 48-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]
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3D Models
DSPIC33CK32MC105-E/PT - Microchip  - 3D model - Quad Flat Packages - 48-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]
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DSPIC33CK32MC105-E/PT Details

  • Manufacturer Part Number:

    DSPIC33CK32MC105-E/PT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    48

  • Manufacturer Package Code:

    TQFP-48

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2020-08-12

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    64 MHz

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G28

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    4

  • Number of External Interrupts:

    4

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    28

  • Number of Timers:

    3

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP48,.35SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Packing Method:

    TRAY

  • RAM (words):

    8192

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    29.6 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, CONTROLLER

DSPIC33CK32MC105-E/PT Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be achieved with an external crystal oscillator is 120 MHz, but it depends on the specific crystal oscillator used and the PCB layout.
  • To configure the oscillator for optimal performance, follow the guidelines in the datasheet for selecting the correct oscillator configuration bits, and ensure that the oscillator circuit is properly laid out on the PCB to minimize noise and interference.
  • The maximum amount of current that can be sourced or sunk by the GPIO pins is 25 mA, but it's recommended to limit the current to 10 mA or less to ensure reliable operation and prevent overheating.
  • To implement a watchdog timer, configure the WDTCON register to enable the watchdog timer, set the timeout period using the WDTPS bits, and periodically reset the watchdog timer using the CLR instruction or by writing to the WDTCON register.
  • The minimum voltage range for the device is 2.2V and the maximum voltage range is 3.6V. Operating the device outside of this range may cause unpredictable behavior or damage the device.

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DSPIC33CK32MC105-E/PT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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