Part Image

DSPIC33CK512MP605-I/M7 - Microchip

Description: MICROCHIP - DSPIC33CK512MP605-I/M7 - Digital Signal Controller, 100 MHz, 512 KB, 39 I/O's, CAN, I2C, I2S, SPI, UART

Download DSPIC33CK512MP605-I/M7 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
DSPIC33CK512MP605-I/M7 - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 48-Lead Very Thin Plastic Quad Flat, No Lead Package (M7) - 6x6 mm Body [VQFN]
click to zoom
3D Models
DSPIC33CK512MP605-I/M7 - Microchip  - 3D model - Quad Flat No-Lead - 48-Lead Very Thin Plastic Quad Flat, No Lead Package (M7) - 6x6 mm Body [VQFN]
click to zoom

DSPIC33CK512MP605-I/M7 Details

  • Manufacturer Part Number:

    DSPIC33CK512MP605-I/M7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    VQFN-48

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    24

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    64 MHz

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    8

  • Number of External Interrupts:

    4

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    48

  • Number of Timers:

    1

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.24SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • RAM (words):

    65536

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.9 mm

  • Supply Current-Max:

    35 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, CONTROLLER

DSPIC33CK512MP605-I/M7 Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the DSPIC33CK512MP605-I/M7 is 180 MHz.
  • The DSPIC33CK512MP605-I/M7 has 512 KB of flash memory.
  • The maximum operating temperature range of the DSPIC33CK512MP605-I/M7 is -40°C to +125°C.
  • Yes, the DSPIC33CK512MP605-I/M7 has a 12-bit, 16-channel Analog-to-Digital Converter (ADC).
  • Yes, the DSPIC33CK512MP605-I/M7 has several low-power modes, including Sleep, Idle, and Doze, which can help reduce power consumption in low-power applications.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

DSPIC33CK512MP605-I/M7 Overview

Use the download button to access the DSPIC33CK512MP605-I/M7 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like DSPIC, or try a keyword search, such as Digital Signal Processors

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

Parts related to DSPIC33CK512MP605-I/M7

Showing 0 results