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DSPIC33EP512MU810-E/BG - Microchip

Description: MCU 16-bit dsPIC RISC 536KB Flash 3.3V Automotive 121-Pin TFBGA Tray

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DSPIC33EP512MU810-E/BG - Microchip PCB footprint - BGA - BGA - 121-Ball Plastic Thin Profile Fine Pitch Ball Grid Array (BG)
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DSPIC33EP512MU810-E/BG - Microchip  - 3D model - BGA - 121-Ball Plastic Thin Profile Fine Pitch Ball Grid Array (BG)
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DSPIC33EP512MU810-E/BG Details

  • Manufacturer Part Number:

    DSPIC33EP512MU810-E/BG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    TPBGA-121

  • Pin Count:

    121

  • Manufacturer Package Code:

    TFBGA-121

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    60 MHz

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B121

  • JESD-609 Code:

    e1

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    15

  • Number of External Interrupts:

    5

  • Number of Terminals:

    121

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA121,11X11,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • RAM (words):

    53248

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100; TS 16949

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    320 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, CONTROLLER

DSPIC33EP512MU810-E/BG Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the DSPIC33EP512MU810-E/BG is 120 MHz.
  • The DSPIC33EP512MU810-E/BG has 512 KB of flash memory.
  • The operating voltage range of the DSPIC33EP512MU810-E/BG is 3.0V to 3.6V.
  • Yes, the DSPIC33EP512MU810-E/BG has a built-in oscillator that can be used as a clock source.
  • The maximum current consumption of the DSPIC33EP512MU810-E/BG is approximately 25 mA at 3.3V and 120 MHz.

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DSPIC33EP512MU810-E/BG Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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