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DTA114YET1G - onsemi

Description: Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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Symbol
DTA114YET1G - onsemi - PCB symbol
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PCB Footprints
DTA114YET1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-75/SOT-416 CASE 463
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3D Models
DTA114YET1G - onsemi - 3D model - SOT23 (3-Pin) - SC-75/SOT-416 CASE 463
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DTA114YET1G Details

  • Manufacturer Part Number:

    DTA114YET1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-75 (SOT-416) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    463-01

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 4.7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DTA114YET1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DTA114YET1G is a standard SOT23-5 package with a 1.5mm x 1.5mm body size and a 0.5mm pitch. The datasheet provides a recommended land pattern and solder mask layout.
  • To ensure proper biasing, connect the input pin (VIN) to a stable voltage source, and decouple the input with a 1uF capacitor to ground. Also, ensure the output pin (VOUT) is properly decoupled with a 10uF capacitor to ground.
  • The maximum output current capability of the DTA114YET1G is 150mA. However, it's recommended to limit the output current to 100mA for optimal performance and to prevent overheating.
  • To protect the DTA114YET1G from overvoltage and undervoltage conditions, use a voltage supervisor or a reset IC to monitor the input voltage and reset the device if it falls outside the recommended operating range (2.5V to 5.5V).
  • The thermal resistance of the DTA114YET1G package is 240°C/W (junction-to-ambient) and 120°C/W (junction-to-case). Proper thermal design and heat sinking are recommended to ensure reliable operation.

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DTA114YET1G Overview

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