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DTA143ZUAT106 - ROHM Semiconductor

Description: Bipolar Transistors - Pre-Biased PNP 50V 100MA PNP -100mA -50V Digital Transistor (Bias Resistor Built-in Transistor)

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DTA143ZUAT106 - ROHM Semiconductor - PCB symbol
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PCB Footprints
DTA143ZUAT106 - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-323_UMT3_1
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3D Models
DTA143ZUAT106 - ROHM Semiconductor - 3D model - SOT23 (3-Pin) - SOT-323_UMT3_1
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DTA143ZUAT106 Details

  • Manufacturer Part Number:

    DTA143ZUAT106

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SC-70

  • Package Description:

    ROHS COMPLIANT, UMT3, SC-70, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.75

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Additional Feature:

    BUILT IN BIAS RESISTOR RATIO IS 10

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation Ambient-Max:

    0.2 W

  • Power Dissipation-Max (Abs):

    0.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

  • VCEsat-Max:

    0.3 V

DTA143ZUAT106 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the bottom layer of the PCB.
  • To ensure reliable operation at high temperatures, it is recommended to follow the recommended operating conditions, use a heat sink if necessary, and ensure good thermal design and layout practices.
  • The maximum allowable power dissipation for the DTA143ZUAT106 is dependent on the ambient temperature and the thermal resistance of the system. Refer to the thermal resistance and power dissipation curves in the datasheet to determine the maximum allowable power dissipation for your specific application.
  • The DTA143ZUAT106 is not hermetically sealed, so it is not recommended for use in high-humidity environments. If you need to use the device in a humid environment, consider using a conformal coating or potting the device to protect it from moisture.
  • The recommended storage condition for the DTA143ZUAT106 is in a dry, cool place, away from direct sunlight and moisture. The device should be stored in its original packaging or in a similar anti-static package to prevent damage from electrostatic discharge.

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DTA143ZUAT106 Overview

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DTA143ZUAT106 Alternates

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For a full list of alternate parts for DTA143ZUAT106, check out Findchips.com