ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal management system to keep the device temperature within the recommended range.
ROHM recommends using a ceramic capacitor with a value of 10uF to 22uF, and an X7R or X5R dielectric, as close to the VIN pin as possible. This helps to filter out noise and ensure stable operation.
To prevent EOS and ESD damage, follow proper handling and assembly procedures, such as using an ESD wrist strap or mat, and avoiding excessive voltage or current stress during testing or operation. Additionally, consider adding ESD protection devices, such as TVS diodes, to the PCB design.
ROHM recommends using a ceramic capacitor with a value of 10uF to 22uF, and an X7R or X5R dielectric, as close to the VOUT pin as possible. This helps to filter out noise and ensure stable operation.
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DTC124XCAT116 Overview
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