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DTC143EE3HZGTL - ROHM Semiconductor

Description: NPN, SOT-416, R1=R2 Potential Divider Type Digital Transistor (Bias Resistor Built-in Transistor) for automotive

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DTC143EE3HZGTL - ROHM Semiconductor - PCB symbol
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PCB Footprints
DTC143EE3HZGTL - ROHM Semiconductor PCB footprint - Other - Other - EMT3_2025
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3D Models
DTC143EE3HZGTL - ROHM Semiconductor - 3D model - Other - EMT3_2025
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DTC143EE3HZGTL Details

  • Manufacturer Part Number:

    DTC143EE3HZGTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-75A, SOT-416, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.15 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

DTC143EE3HZGTL Frequently Asked Questions (FAQs)

  • ROHM provides a recommended PCB layout and land pattern in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, thermal management, and reliability.
  • The DTC143EE3HZGTL has a high power dissipation rating. Ensure proper thermal management by providing a heat sink, using thermal vias, and optimizing the PCB design for heat dissipation. ROHM also provides thermal design guidelines in their documentation.
  • ROHM provides recommended soldering conditions and reflow profiles in their documentation. It's crucial to follow these guidelines to prevent damage to the device during the assembly process.
  • Follow ROHM's guidelines for PCB design, component placement, and shielding to minimize EMI. Additionally, ensure proper grounding, decoupling, and filtering to reduce electromagnetic radiation.
  • ROHM provides reliability and durability data in their documentation. The DTC143EE3HZGTL is designed to operate in harsh environments, but it's essential to follow proper design and assembly guidelines to ensure optimal performance and reliability.

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DTC143EE3HZGTL Overview

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