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DXT2011P5-13 - Diodes Incorporated

Description: Diodes Inc DXT2011P5-13 NPN Bipolar Transistor, 6 A, 100 V, 3-Pin PowerDI 5

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DXT2011P5-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
DXT2011P5-13 - Diodes Incorporated PCB footprint - Other - Other - DXT2011P5-13-5
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DXT2011P5-13 - Diodes Incorporated - 3D model - Other - DXT2011P5-13-5
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DXT2011P5-13 Details

  • Manufacturer Part Number:

    DXT2011P5-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-252

  • Package Description:

    GREEN, PLASTIC, 3 PIN

  • Pin Count:

    4

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Collector Current-Max (IC):

    6 A

  • Collector-Emitter Voltage-Max:

    100 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    10

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    3.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    130 MHz

DXT2011P5-13 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern around the thermal pad is suggested.
  • Ensure proper thermal management, follow recommended PCB layout, and consider derating the device's power handling at higher temperatures to prevent overheating.
  • The DXT2011P5-13 has built-in ESD protection, but additional external protection may be necessary depending on the application. Follow proper PCB design and handling practices to prevent latch-up.
  • The DXT2011P5-13 is a commercial-grade device, but Diodes Incorporated offers other devices with higher reliability and automotive-grade options. Consult with Diodes Incorporated for specific requirements.
  • Consult the datasheet and application notes for troubleshooting guidelines. Use oscilloscopes and logic analyzers to debug signal integrity issues. Contact Diodes Incorporated's technical support for further assistance.

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DXT2011P5-13 Overview

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