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DZT5401-13 - Diodes Incorporated

Description: Diodes Inc DZT5401-13 PNP Bipolar Transistor, -600 mA, -150 V SOT-223

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PCB Footprints
DZT5401-13 - Diodes Incorporated PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - 3-Pin SOT-223
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3D Models
DZT5401-13 - Diodes Incorporated  - 3D model - SOT223 (3-Pin) - 3-Pin SOT-223
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DZT5401-13 Details

  • Manufacturer Part Number:

    DZT5401-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, PLASTIC PACKAGE-4

  • Pin Count:

    4

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    0.6 A

  • Collector-Emitter Voltage-Max:

    150 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    50

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    1 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

DZT5401-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for the DZT5401-13 should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure a low-thermal-resistance path to the PCB's ground plane. Use multiple vias to connect the thermal pad to the ground plane, and keep the thermal path as short as possible.
  • To ensure the DZT5401-13's ESD protection is effective, follow proper handling and storage procedures to prevent ESD damage. Use an ESD wrist strap or mat when handling the device, and store it in an anti-static bag or container. During PCB assembly, use ESD-safe tools and materials, and ensure the PCB is properly grounded.
  • The DZT5401-13 is rated for operation between -40°C and 125°C. Ensure the device operates within the recommended voltage range (4.5V to 5.5V) and current range (up to 1A). Avoid exceeding the maximum junction temperature (150°C) to prevent thermal damage.
  • To troubleshoot output voltage regulation issues, check the input voltage, output load, and PCB layout. Verify the input voltage is within the recommended range, and the output load is within the device's current rating. Check for any PCB layout issues, such as inadequate decoupling or poor thermal design, that may affect the device's performance.
  • For high-reliability applications, ensure the device is operated within its recommended specifications, and follow proper derating guidelines. Implement adequate thermal management, and consider using redundant or fault-tolerant designs to minimize the risk of single-point failures.

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DZT5401-13 Overview

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