Wolfspeed recommends a 2-layer PCB with a thermal via array under the device to dissipate heat. A minimum of 10 thermal vias with a diameter of 0.3 mm, spaced 1.2 mm apart, is recommended. Additionally, a thermal pad with a minimum size of 10 mm x 10 mm is suggested.
To prevent overheating, ensure the device is mounted on a heat sink with a thermal resistance of ≤ 1.5°C/W. Monitor the junction temperature (Tj) and keep it below the maximum rating of 150°C. Implement a thermal management system, such as a fan or heat sink, to maintain a safe operating temperature.
Wolfspeed recommends using a soldering temperature of 260°C (max) and a soldering time of 3 seconds (max) to prevent damage to the device. Use a solder with a melting point above 217°C and follow the recommended land pattern and soldering guidelines in the datasheet.
Handle the device in an ESD-protected environment, using ESD-protective packaging, wrist straps, and mats. Store the device in its original packaging or in a conductive bag to prevent ESD damage.
Operating the device beyond the recommended conditions can lead to reduced performance, decreased lifespan, and potential failure. Ensure the device operates within the recommended voltage, current, and temperature ranges to maintain reliability and performance.
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E3M0045065K Overview
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