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E3M0075120K - Wolfspeed

Description: 1200 V, 75 mΩ, TO-247-4 package, Automotive qualified, Discrete SiC MOSFET

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E3M0075120K - Wolfspeed PCB footprint - Other - Other - TO-247-4L
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E3M0075120K - Wolfspeed  - 3D model - Other - TO-247-4L
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E3M0075120K Details

  • Manufacturer Part Number:

    E3M0075120K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Wolfspeed

  • YTEOL:

    6

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1200 V

  • Drain Current-Max (ID):

    32 A

  • Drain-source On Resistance-Max:

    0.0975 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    2.7 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T4

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    145 W

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Reference Standard:

    AEC-Q101; IEC-60747-8-4

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

E3M0075120K Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the E3M0075120K is -40°C to 150°C.
  • Proper thermal management can be achieved by using a heat sink with a thermal interface material, ensuring good airflow, and keeping the device away from heat sources.
  • The recommended PCB layout and design considerations include using a multi-layer board, keeping the device away from noise sources, and using a ground plane to reduce electromagnetic interference.
  • The high-frequency switching noise can be handled by using a filter, such as an LC filter or a common-mode choke, and by following proper PCB design and layout guidelines.
  • The recommended gate drive circuits and components include using a gate driver IC, such as the UCC37322, and selecting components with high-frequency capabilities, such as low-ESR capacitors and low-inductance resistors.

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