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EC103D3 - LITTELFUSE

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EC103D3 - LITTELFUSE  - 3D model
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EC103D3 Details

  • Manufacturer Part Number:

    EC103D3

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-92

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    40 V/us

  • DC Gate Trigger Current-Max:

    0.5 mA

  • DC Gate Trigger Voltage-Max:

    0.8 V

  • Holding Current-Max:

    5 mA

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.05 mA

  • Moisture Sensitivity Level:

    2

  • Non-Repetitive Pk On-state Cur:

    20 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    800 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    0.8 A

  • Repetitive Peak Off-state Voltage:

    400 V

  • Repetitive Peak Reverse Voltage:

    400 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

EC103D3 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to have a large copper area on the PCB under the device, and to use thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, keeping the PCB layer stack-up symmetrical can help reduce thermal resistance.
  • To ensure reliable soldering, it is recommended to follow the recommended soldering profile, which is typically a peak temperature of 260°C for 10-30 seconds. Using a solder with a high melting point (e.g., SAC305) and a flux that is compatible with the device's termination material is also recommended.
  • The maximum allowed voltage stress on the EC103D3 during assembly or handling is typically 1.5 times the rated voltage. However, it is recommended to consult the manufacturer's application notes or contact their technical support for specific guidance.
  • While the EC103D3 is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz. However, the device's performance may degrade at higher frequencies due to internal parasitic inductance and capacitance. It is recommended to consult the manufacturer's application notes or contact their technical support for specific guidance.
  • To determine the correct fuse rating, you need to consider the maximum current and voltage in your application. The fuse rating should be selected based on the maximum expected current and voltage, taking into account any inrush currents or voltage surges. It is recommended to consult the manufacturer's selection guide or contact their technical support for specific guidance.

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EC103D3 Overview

Use the download button to access the EC103D3 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like EC103, or try a keyword search, such as Silicon Controlled Rectifiers

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