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ECA2WHG330 - Panasonic

Description: Panasonic 33µF 450V dc Aluminium Electrolytic Capacitor, Through Hole 16 (Dia.) x 31.5mm +105°C 16mm 7.5mm

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ECA2WHG330 - Panasonic - PCB symbol
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PCB Footprints
ECA2WHG330 - Panasonic PCB footprint - Capacitor, Polarized Radial Diameter - Capacitor, Polarized Radial Diameter - CASE CODE 16.0 X31.5
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3D Models
ECA2WHG330 - Panasonic - 3D model - Capacitor, Polarized Radial Diameter - CASE CODE 16.0 X31.5
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ECA2WHG330 Details

  • Manufacturer Part Number:

    ECA2WHG330

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.20

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    7

  • Capacitance:

    33 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    16 mm

  • Dielectric Material:

    ALUMINUM (WET)

  • JESD-609 Code:

    e3

  • Leakage Current:

    0.901 mA

  • Length:

    31.5 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Radial

  • Packing Method:

    Bulk

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    450 V

  • Reference Standard:

    AEC-Q200

  • Ripple Current:

    155 mA

  • Surface Mount:

    NO

  • Tan Delta:

    0.24

  • Terminal Finish:

    Tin (Sn)

  • Terminal Pitch:

    7.5 mm

  • Terminal Shape:

    WIRE

ECA2WHG330 Frequently Asked Questions (FAQs)

  • The recommended land pattern for ECA2WHG330 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal stress.
  • During reflow soldering, it's crucial to follow the recommended temperature profile to prevent damage to the component. The peak temperature should not exceed 260°C, and the time above 220°C should be less than 60 seconds. Additionally, ensure that the component is properly aligned and secured to prevent movement during the reflow process.
  • The maximum operating temperature range for ECA2WHG330 is -40°C to 125°C. However, it's essential to note that the component's performance and reliability may degrade if operated at the extreme ends of this range for an extended period.
  • While ECA2WHG330 is designed to be robust, it's not recommended for use in high-vibration environments without proper mounting and securing. The component's terminals may be susceptible to damage or disconnection due to excessive vibration. It's essential to follow proper mounting and securing guidelines to ensure reliable operation.
  • To prevent moisture absorption, it's recommended to store ECA2WHG330 in a dry, cool place with a relative humidity of less than 60%. The component should be stored in its original packaging or a sealed bag with desiccant to maintain a low humidity environment.

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ECA2WHG330 Overview

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