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ECH8310-TL-H - onsemi

Description: 4V drive; Protection diode in

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ECH8310-TL-H - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - ECH8310-TL-H
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ECH8310-TL-H - onsemi  - 3D model - SO Transistor Flat Lead - ECH8310-TL-H
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ECH8310-TL-H Details

  • Manufacturer Part Number:

    ECH8310-TL-H

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-28FL / ECH8

  • Pin Count:

    8

  • Manufacturer Package Code:

    318BF

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.4

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    9 A

  • Drain-source On Resistance-Max:

    0.017 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    250 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.5 W

  • Pulsed Drain Current-Max (IDM):

    60 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

ECH8310-TL-H Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.
  • Handle the device with ESD-protective equipment and follow standard ESD precautions. The device has built-in ESD protection, but it's not a substitute for proper handling and storage procedures.
  • Yes, the ECH8310-TL-H is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure you follow the recommended operating conditions and design guidelines for these applications.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60s max. For rework, use a low-temperature soldering iron (< 350°C) and avoid applying excessive force or heat.

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ECH8310-TL-H Overview

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