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ECH8655R-TL-H - onsemi

Description: Low on resistance; 2.5 V drive; Common-drain type; Built-in gate protection resistor; Best suited for LiB charging and discharging switch; Protection diode in

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PCB Footprints
ECH8655R-TL-H - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SOT−28FL / ECH8 CASE 318BF ISSUE O
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ECH8655R-TL-H Details

  • Manufacturer Part Number:

    ECH8655R-TL-H

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-28FL / ECH8

  • Pin Count:

    8

  • Manufacturer Package Code:

    318BF

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DS Breakdown Voltage-Min:

    24 V

  • Drain Current-Max (ID):

    9 A

  • Drain-source On Resistance-Max:

    0.0255 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.5 W

  • Pulsed Drain Current-Max (IDM):

    60 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ECH8655R-TL-H Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper PCB design, and consider using a thermistor or thermocouple for temperature monitoring.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, 10uF to 22uF is recommended, while output capacitors should be 10uF to 47uF.
  • Use a shielded enclosure, keep sensitive components away from the ECH8655R-TL-H, and ensure proper grounding and decoupling. Implement EMI filters or common-mode chokes if necessary.
  • Follow the JEDEC J-STD-020D.1 standard for reflow soldering. The recommended peak temperature is 260°C, with a maximum time above 217°C of 30 seconds.

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ECH8655R-TL-H Overview

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