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ECH8693R-TL-W - onsemi

Description: 2.5 V drive; Common-Drain Type; ESD Diode-Protected Gate; RoHS compliance; Low On-Resistance; Built-in Gate Protection Resistor

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PCB Footprints
ECH8693R-TL-W - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SOT-28FL / ECH8 CASE 318BF ISSUE O
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3D Models
ECH8693R-TL-W - onsemi  - 3D model - SO Transistor Flat Lead - SOT-28FL / ECH8 CASE 318BF ISSUE O
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ECH8693R-TL-W Details

  • Manufacturer Part Number:

    ECH8693R-TL-W

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-28FL / ECH8

  • Pin Count:

    8

  • Manufacturer Package Code:

    318BF

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Configuration:

    COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

  • DS Breakdown Voltage-Min:

    24 V

  • Drain Current-Max (ID):

    14 A

  • Drain-source On Resistance-Max:

    0.0091 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    60 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ECH8693R-TL-W Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the component away from heat sources and ensure good airflow.
  • Implement a robust thermal management system, ensure good airflow, and consider using a heat sink or thermal interface material. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use low-ESR capacitors with a minimum capacitance of 10uF for input and output filtering. X5R or X7R dielectric capacitors are recommended for their stability across temperature and voltage ranges.
  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and ensure good grounding and shielding of cables. Implement EMI filters and follow proper PCB layout practices.
  • Follow the JEDEC J-STD-020D.1 standard for reflow soldering, with a peak temperature of 260°C and a dwell time of 20-40 seconds. Ensure proper soldering techniques and handling to prevent damage.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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ECH8693R-TL-W Overview

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