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ECH8695R-TL-W - onsemi

Description: 2.5 V drive; Common-Drain Type; ESD Diode-Protected Gate; RoHS compliance; Low On-Resistance; Built-in Gate Protection Resistor

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PCB Footprints
ECH8695R-TL-W - onsemi PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - SOT-28FL/ECH8
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3D Models
ECH8695R-TL-W - onsemi  - 3D model - SOT23 (8-Pin) - SOT-28FL/ECH8
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ECH8695R-TL-W Details

  • Manufacturer Part Number:

    ECH8695R-TL-W

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-28 FL / ECH-8

  • Package Description:

    SOT-28FL, 8 PIN

  • Manufacturer Package Code:

    318BF

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Configuration:

    COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    24 V

  • Drain Current-Max (ID):

    11 A

  • Drain-source On Resistance-Max:

    0.0133 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.5 W

  • Pulsed Drain Current-Max (IDM):

    60 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ECH8695R-TL-W Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, ensure proper PCB design, and follow the recommended operating conditions. Consider using a thermal interface material (TIM) for improved heat transfer.
  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage.
  • Consult the application note and reference design provided by onsemi. Optimize the PCB layout, component selection, and thermal management system for your specific use case.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60s max. For rework, use a low-temperature soldering iron and avoid applying excessive force or heat.

Trust Checks

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ECH8695R-TL-W Overview

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