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ECH8697R-TL-W - onsemi

Description: 2.5 V drive; Common-Drain Type; ESD Diode-Protected Gate; RoHS compliance; Low On-Resistance; Built-in Gate Protection Resistor

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PCB Footprints
ECH8697R-TL-W - onsemi PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - SOT-28FL/ECH8
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3D Models
ECH8697R-TL-W - onsemi  - 3D model - SOT23 (8-Pin) - SOT-28FL/ECH8
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ECH8697R-TL-W Details

  • Manufacturer Part Number:

    ECH8697R-TL-W

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-28FL / ECH8

  • Package Description:

    SOT-28FL, 8 PIN

  • Manufacturer Package Code:

    318BF

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    24 V

  • Drain Current-Max (ID):

    10 A

  • Drain-source On Resistance-Max:

    0.0175 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.5 W

  • Pulsed Drain Current-Max (IDM):

    60 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ECH8697R-TL-W Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper airflow and avoid thermal hotspots.
  • Monitor input voltage, output voltage, current, and temperature. Implement over-voltage protection (OVP), under-voltage protection (UVP), and over-temperature protection (OTP) to ensure safe operation.
  • Use a shielded enclosure, keep sensitive components away from the ECH8697R-TL-W, and use a common-mode choke or ferrite bead to reduce EMI emissions.
  • Use a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 4.7 μF to 10 μF, depending on the specific application requirements.

Trust Checks

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Manufacturer Collaborated
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System Verified
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Sponsored

ECH8697R-TL-W Overview

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