ECS-2520S33-200-FN-TR footprint, schematic symbol and 3D model by ECS

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ECS-2520S33-200-FN-TR Details

The recommended land pattern for ECS-2520S33-200-FN-TR is a rectangular pad with a size of 2.5mm x 1.5mm, with a non-solder mask defined (NSMD) pad shape.
Yes, ECS-2520S33-200-FN-TR is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating.
The recommended soldering profile for ECS-2520S33-200-FN-TR is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow the manufacturer's recommended soldering profile to prevent damage to the component.
Yes, ECS-2520S33-200-FN-TR is compatible with lead-free soldering. The component is designed to meet the requirements of the RoHS directive and can be soldered using lead-free soldering processes.
The typical power dissipation of ECS-2520S33-200-FN-TR is 1.5W. However, the actual power dissipation may vary depending on the application and operating conditions.

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Use the download button to access the ECS-2520S33-200-FN-TR schematic symbol, PCB footprint, and 3D model.

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