ECS-5032MV-100-BN-TR footprint, schematic symbol and 3D model by ECS

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ECS-5032MV-100-BN-TR Details

The recommended land pattern for ECS-5032MV-100-BN-TR is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
Yes, ECS-5032MV-100-BN-TR is rated for operation up to 125°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating.
The recommended soldering profile for ECS-5032MV-100-BN-TR is a peak temperature of 240°C, with a dwell time of 30-60 seconds above 217°C. It's essential to follow the manufacturer's recommended soldering profile to prevent damage to the component.
Yes, ECS-5032MV-100-BN-TR is compatible with lead-free soldering. The component is designed to meet the requirements of the RoHS directive, making it suitable for use in lead-free soldering applications.
The typical power dissipation of ECS-5032MV-100-BN-TR is 1.5W. However, the actual power dissipation may vary depending on the specific application and operating conditions.

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