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EDB4432BBPA-1D-F-R - Micron

Description: DRAM LPDDR2 4G 128MX32 FBGA

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EDB4432BBPA-1D-F-R - Micron PCB footprint - BGA - BGA - 168-Ball FBGA (12mm x 12mm)
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EDB4432BBPA-1D-F-R - Micron  - 3D model - BGA - 168-Ball FBGA (12mm x 12mm)
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EDB4432BBPA-1D-F-R Details

  • Manufacturer Part Number:

    EDB4432BBPA-1D-F-R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    12 X 12 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-168

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Access Mode:

    SINGLE BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B168

  • JESD-609 Code:

    e1

  • Length:

    12 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    LPDDR2 DRAM

  • Memory Width:

    32

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    168

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Organization:

    128MX32

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.8 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    1.3 V

  • Supply Voltage-Min (Vsup):

    1.14 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    12 mm

EDB4432BBPA-1D-F-R Frequently Asked Questions (FAQs)

  • For optimal signal integrity, it's recommended to follow Micron's PCB layout guidelines, which include using a 4-layer PCB with a solid ground plane, keeping signal traces short and direct, and using 50-ohm transmission lines. Additionally, it's essential to minimize vias and use controlled impedance routing.
  • To handle thermal management, ensure good airflow around the module, and consider using a heat sink or thermal interface material if the system operates in high-temperature environments. The maximum junction temperature (TJ) is 95°C, so it's essential to keep the module within the recommended operating temperature range.
  • The timing requirements for clock, command, and data signals can be found in the Micron DDR3 SDRAM datasheet. However, as a general guideline, ensure that the clock signal has a minimum frequency of 100 MHz, and the command and data signals meet the specified setup and hold times.
  • Implement power sequencing by applying power to the VDD and VDDQ pins simultaneously, followed by the VTT pin. Ensure that the voltage regulator module (VRM) provides a stable 1.5V supply for VDD and VDDQ, and 2.5V for VTT. Use a low-dropout regulator (LDO) or a switching regulator with a high power supply rejection ratio (PSRR) to minimize noise and ripple.
  • For ZQ calibration, follow the procedure outlined in the Micron datasheet, which involves writing a specific pattern to the memory and then reading it back to determine the optimal ZQ calibration value. For refresh operations, ensure that the memory controller issues refresh commands at a rate of at least 3.9 μs, with a maximum refresh interval of 64 ms.

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EDB4432BBPA-1D-F-R Overview

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Part Image EDB4432BBPA-1D-F-D Micron Technology Inc

LPDDR2 DRAM, 128MX32, CMOS, PBGA168