- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for EDZTE613.9B
- Part Number EDZTE613.9B
- Manufacturer ROHM Semiconductor
- Pin Count 2
- Part Category Diode
- Package Category Small Outline Diode Flat Lead
- Footprint Name Small Outline Diode Flat Lead - ROHM-EMD2-1
- Released Date Feb 16, 2021
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
EDZTE613.9B Details
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Manufacturer Part Number:
EDZTE613.9B
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Package Description:
EMD2, SC-79, 2 PIN
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.50
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Manufacturer:
ROHM Semiconductor
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YTEOL:
0
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Additional Feature:
HIGH RELIABILITY
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Configuration:
SINGLE
EDZTE613.9B Frequently Asked Questions (FAQs)
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A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the bottom layer. Additionally, keeping the thermal pad away from other components and traces can help reduce thermal resistance.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, ensure good thermal design, and consider using a heat sink or thermal interface material. Additionally, derating the device's power consumption and using a thermal protection circuit can help prevent overheating.
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To prevent damage, handle the device by the body and not the leads, avoid bending or twisting the leads, and store the device in a dry, cool place away from direct sunlight. It's also essential to follow the recommended storage temperature and humidity ranges.
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To troubleshoot issues with the device, start by checking the PCB layout and thermal design, ensuring that the device is properly soldered and that there are no signs of physical damage. Next, verify that the input voltage and current are within the recommended ranges, and check for any signs of electrical overstress. If the issue persists, consider consulting the datasheet or contacting ROHM Semiconductor's technical support.
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Yes, ROHM Semiconductor recommends following the standard reflow soldering process, with a peak temperature of 260°C and a time above liquidus of 30-60 seconds. It's also essential to follow the recommended storage and handling procedures to prevent damage during assembly.
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EDZTE613.9B Overview
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