EDZVFHT2R30B footprint, schematic symbol and 3D model by ROHM Semiconductor

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EDZVFHT2R30B Details

ROHM recommends a thermal pad size of at least 2.5mm x 2.5mm with multiple vias to the ground plane to ensure efficient heat dissipation. A thermal resistance of 10°C/W or less is recommended.
The EDZVFHT2R30B requires a bias voltage of 2.5V to 5.5V. Ensure the input voltage is within this range and the output is properly terminated to avoid oscillations.
While the datasheet doesn't specify a maximum operating frequency, ROHM recommends operating the device up to 100MHz for optimal performance and stability.
The EDZVFHT2R30B is rated for operation up to 125°C. However, derating the power dissipation is recommended for temperatures above 85°C to ensure reliability and prevent thermal runaway.
ROHM recommends using a TVS diode or ESD protection circuitry on the input lines to prevent damage from electrostatic discharge. The device itself has some ESD protection, but additional protection is recommended for high-reliability applications.

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