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EEE1CA470AP - Panasonic

Description: PANASONIC - EEE1CA470AP - SMD Aluminium Electrolytic Capacitor, Radial Can - SMD, 47 µF, 16 V, S Series, 2000 hours @ 85°C

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Symbol
EEE1CA470AP - Panasonic - PCB symbol
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PCB Footprints
EEE1CA470AP - Panasonic PCB footprint - Other - Other - SMD_Lytic_D
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3D Models
EEE1CA470AP - Panasonic - 3D model - Other - SMD_Lytic_D
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EEE1CA470AP Details

  • Manufacturer Part Number:

    EEE1CA470AP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.20

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Capacitance:

    47 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    6.3 mm

  • Dielectric Material:

    ALUMINUM (WET)

  • Height:

    5.4 mm

  • Leakage Current:

    0.00752 mA

  • Length:

    6.6 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED, 15 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    16 V

  • Reference Standard:

    AEC-Q200

  • Ripple Current:

    70 mA

  • Size Code:

    2626

  • Surface Mount:

    YES

  • Tan Delta:

    0.16

  • Terminal Shape:

    FLAT

  • Width:

    6.6 mm

EEE1CA470AP Frequently Asked Questions (FAQs)

  • The recommended land pattern for EEE1CA470AP is a rectangular pad with a size of 2.5mm x 1.6mm, with a solder mask opening of 2.2mm x 1.3mm. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal stress.
  • Yes, EEE1CA470AP is rated for operation up to 125°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and to follow the recommended operating conditions.
  • For reflow soldering, it's recommended to use a peak temperature of 260°C for 10-30 seconds. The component should be placed on a solder paste layer with a thickness of 0.1-0.2mm. It's also essential to follow the recommended reflow profile to prevent thermal damage.
  • Yes, EEE1CA470AP is compatible with lead-free soldering. The component is designed to meet the requirements of lead-free soldering, and it can be used with SAC305 or other lead-free solder alloys.
  • EEE1CA470AP should be stored in a dry, cool place with a temperature range of 5-30°C and a relative humidity of 60% or less. The component should be stored in its original packaging or in a sealed bag to prevent moisture absorption.

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EEE1CA470AP Overview

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