The recommended land pattern for EEE1HA100AP is a rectangular pad with a size of 2.5mm x 1.5mm, with a solder mask opening of 2.2mm x 1.2mm. It's also recommended to have a solder fillet of 0.2mm to ensure good solder joint reliability.
Yes, EEE1HA100AP is rated for operation up to 125°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and reduce the risk of failure.
EEE1HA100AP should be stored in a dry, cool place, away from direct sunlight and moisture. It's recommended to store the components in their original packaging or in a sealed bag with desiccant to prevent moisture absorption. During shipping, the components should be protected from mechanical stress and vibration.
Yes, EEE1HA100AP is compatible with lead-free soldering processes. The component is designed to withstand the higher temperatures associated with lead-free soldering, and its terminations are made of a lead-free material.
The recommended reflow profile for EEE1HA100AP is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C. The ramp-up rate should be 3°C/s, and the ramp-down rate should be 6°C/s.
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EEE1HA100AP Overview
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