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EEEFK1E330AP - Panasonic

Description: PANASONIC - EEEFK1E330AP - SMD Aluminium Electrolytic Capacitor, Radial Can - SMD, 33 µF, 25 V, FK Series, 2000 hours @ 105°C

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Symbol
EEEFK1E330AP - Panasonic - PCB symbol
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PCB Footprints
EEEFK1E330AP - Panasonic PCB footprint - Other - Other - SMD_Lytic_D
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3D Models
EEEFK1E330AP - Panasonic - 3D model - Other - SMD_Lytic_D
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EEEFK1E330AP Details

  • Manufacturer Part Number:

    EEEFK1E330AP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    7

  • Capacitance:

    33 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Dielectric Material:

    ALUMINUM (WET)

  • Height:

    5.8 mm

  • Leakage Current:

    0.0083 mA

  • Length:

    6.6 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED, 15 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    25 V

  • Reference Standard:

    AEC-Q200

  • Ripple Current:

    156 mA

  • Size Code:

    2626

  • Surface Mount:

    YES

  • Tan Delta:

    0.14

  • Terminal Shape:

    FLAT

  • Width:

    6.6 mm

EEEFK1E330AP Frequently Asked Questions (FAQs)

  • The recommended land pattern for EEEFK1E330AP can be found in the Panasonic recommended land pattern document or by consulting with a PCB design expert. The land pattern should ensure good solderability and thermal dissipation.
  • The EEEFK1E330AP is a moisture-sensitive device and should be handled according to the MSL (Moisture Sensitivity Level) rating specified in the datasheet. This typically involves storing the components in a dry environment, using a dry pack or nitrogen-filled packaging, and following proper baking procedures before reflow soldering.
  • The maximum allowable voltage derating for EEEFK1E330AP depends on the specific application and operating conditions. As a general rule, it is recommended to derate the voltage by 10-20% to ensure reliable operation and prevent premature failure. Consult with a design expert or Panasonic support for specific guidance.
  • The EEEFK1E330AP is rated for operation up to 125°C, but its performance and lifespan may be affected at high temperatures. Consult with a design expert or Panasonic support to determine the suitability of the component for your specific high-temperature application.
  • To ensure proper soldering of the EEEFK1E330AP, follow the recommended reflow soldering profile, use a solder paste with a suitable melting point, and ensure good solder wetting and fillet formation. Consult with a PCB assembly expert or Panasonic support for specific guidance.

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EEEFK1E330AP Overview

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Part Image EEVFK1E330R Panasonic Electronic Components

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For a full list of alternate parts for EEEFK1E330AP, check out Findchips.com