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EEEFN1K100XP - Panasonic

Description: PANASONIC - EEEFN1K100XP - SMD Aluminium Electrolytic Capacitor, Radial Can - SMD, 10 µF, 80 V, 2.4 ohm, 2000 hours @ 105°C

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Symbol
EEEFN1K100XP - Panasonic - PCB symbol
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PCB Footprints
EEEFN1K100XP - Panasonic PCB footprint - Other - Other - SMD_Lytic_D8
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3D Models
EEEFN1K100XP - Panasonic - 3D model - Other - SMD_Lytic_D8
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EEEFN1K100XP Details

  • Manufacturer Part Number:

    EEEFN1K100XP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.20

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    7

  • Additional Feature:

    ESR IS MEASURED AT 100KHZ

  • Capacitance:

    10 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    6.3 mm

  • Dielectric Material:

    ALUMINUM (WET)

  • ESR:

    2400 mΩ

  • Height:

    7.7 mm

  • Leakage Current:

    0.008 mA

  • Length:

    6.6 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED, 15 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    80 V

  • Reference Standard:

    AEC-Q200

  • Ripple Current:

    39 mA

  • Size Code:

    2626

  • Surface Mount:

    YES

  • Tan Delta:

    0.08

  • Terminal Shape:

    FLAT

  • Width:

    6.6 mm

EEEFN1K100XP Frequently Asked Questions (FAQs)

  • The recommended land pattern for EEEFN1K100XP is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask clearance of 0.2mm. It's also recommended to have a via-in-pad design to reduce thermal resistance.
  • To ensure proper thermal management, it's recommended to attach a heat sink to the component, and to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. The PCB should also have a thermal via array underneath the component to dissipate heat efficiently.
  • The maximum operating temperature range for EEEFN1K100XP is -40°C to 105°C. However, it's recommended to operate the component within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • To ensure the reliability of EEEFN1K100XP in high-vibration environments, it's recommended to use a robust mounting method, such as screwing or adhesive bonding, and to ensure that the component is properly secured to the PCB. Additionally, the PCB should be designed to minimize flexure and vibration.
  • The recommended storage condition for EEEFN1K100XP is in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. The component should be stored in its original packaging or in a sealed bag to prevent moisture absorption.

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EEEFN1K100XP Overview

Use the download button to access the EEEFN1K100XP schematic symbol, PCB footprint, and 3D model.
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