The recommended land pattern for EEETC1C221V is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask clearance of 0.2mm. It's also recommended to have a via-in-pad design to reduce thermal resistance.
To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB, and to use a thermal interface material (TIM) between the capacitor and the heat sink. The thermal pad should be connected to a heat sink or a metal plate to dissipate heat efficiently.
The derating curve for EEETC1C221V is not explicitly provided in the datasheet, but it can be estimated based on the temperature coefficient of capacitance. As a general rule, the capacitance value decreases by 2-3% per 10°C increase in temperature above 25°C.
Yes, EEETC1C221V is designed to withstand high-vibration environments. It has a vibration resistance of 10Hz to 2000Hz, 10G acceleration, and a shock resistance of 100G, 6ms. However, it's recommended to follow the recommended mounting and soldering procedures to ensure reliable operation.
The ESR of EEETC1C221V is not explicitly provided in the datasheet, but it can be estimated based on the impedance characteristics. The ESR is typically around 10-20 mΩ at 100 kHz, but it may vary depending on the frequency and operating conditions.
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EEETC1C221V Overview
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