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EEETG1K100P - Panasonic

Description: Panasonic 10µF 80V dc Aluminium Electrolytic Capacitor, Surface Mount 8 (Dia.) x 10.2mm +125°C 8mm

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PCB Footprints
EEETG1K100P - Panasonic PCB footprint - Capacitor Al Electrolytic - Capacitor Al Electrolytic - 8x10.2
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3D Models
EEETG1K100P - Panasonic  - 3D model - Capacitor Al Electrolytic - 8x10.2
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EEETG1K100P Details

  • Manufacturer Part Number:

    EEETG1K100P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.20

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    7

  • Additional Feature:

    ESR is MEASURED AT 100KHZ,

  • Capacitance:

    10 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    8 mm

  • Dielectric Material:

    ALUMINUM (WET)

  • ESR:

    1300 mΩ

  • Height:

    10.2 mm

  • JESD-609 Code:

    e6

  • Leakage Current:

    0.008 mA

  • Length:

    8.3 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED, 15 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    80 V

  • Reference Standard:

    AEC-Q200

  • Ripple Current:

    45.5 mA

  • Size Code:

    3333

  • Surface Mount:

    YES

  • Tan Delta:

    0.12

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Shape:

    FLAT

  • Width:

    8.3 mm

EEETG1K100P Frequently Asked Questions (FAQs)

  • The recommended land pattern for EEETG1K100P can be found in the Panasonic recommended land pattern document or by consulting with a PCB design expert. A general guideline is to use a land pattern with a pad size of 2.5mm x 1.5mm and a spacing of 1.5mm between pads.
  • To handle thermal management, ensure good airflow around the component, use a thermal pad or thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and consider using a heat sink or metal core PCB. The maximum operating temperature is 125°C, so ensure the component is kept below this temperature.
  • The derating curve for EEETG1K100P can be obtained by contacting Panasonic's technical support or by consulting with a reliability expert. A general guideline is to derate the component by 1.25% per °C above 70°C to ensure reliable operation.
  • EEETG1K100P is designed to withstand vibrations up to 10G (10-2000Hz). However, for high-vibration environments, it's recommended to consult with a mechanical engineer to ensure the component is properly secured and the PCB is designed to withstand the vibrations.
  • The recommended soldering profile for EEETG1K100P is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure the soldering process is done in a nitrogen atmosphere to prevent oxidation.

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EEETG1K100P Overview

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