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EEHZC1E470P - Panasonic

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EEHZC1E470P - Panasonic PCB footprint - Other - Other - Hybrid_D_D8_1
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EEHZC1E470P - Panasonic  - 3D model - Other - Hybrid_D_D8_1
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EEHZC1E470P Details

  • Manufacturer Part Number:

    EEHZC1E470P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.20

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    9

  • Additional Feature:

    ESR IS MEASURED AT 100 KHZ

  • Capacitance:

    47 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    6.3 mm

  • Dielectric Material:

    ALUMINUM (SOLID POLYMER)

  • ESR:

    50 mΩ

  • Height:

    5.8 mm

  • Leakage Current:

    0.01175 mA

  • Length:

    6.6 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED, 15 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    25 V

  • Reference Standard:

    AEC-Q200

  • Ripple Current:

    135 mA

  • Size Code:

    2626

  • Surface Mount:

    YES

  • Tan Delta:

    0.14

  • Terminal Shape:

    FLAT

  • Width:

    6.6 mm

EEHZC1E470P Frequently Asked Questions (FAQs)

  • The recommended land pattern for EEHZC1E470P can be found in the Panasonic Electronic Components' recommended footprint document or by consulting with a PCB design expert. A general guideline is to follow the IPC-7351 standard for surface-mount components.
  • EEHZC1E470P is a moisture-sensitive device. It's essential to follow the recommended storage and handling procedures to prevent moisture absorption. Store the components in a dry environment, and use a dry pack or desiccant to maintain a low humidity level. Follow the MSL (Moisture Sensitivity Level) guidelines for handling and reflow soldering.
  • The maximum reflow temperature for EEHZC1E470P is 260°C (500°F) for a maximum of 30 seconds. Exceeding this temperature can cause damage to the component. It's essential to follow the recommended reflow profile to ensure reliable soldering.
  • EEHZC1E470P is designed for general-purpose use, but it may not be suitable for high-vibration environments. If your application requires high vibration resistance, consider using a component specifically designed for such environments, or consult with a Panasonic representative for guidance.
  • The ESR of EEHZC1E470P can be determined by measuring the impedance of the component using an impedance analyzer or a vector network analyzer. You can also consult the Panasonic datasheet or application notes for guidance on ESR calculation.

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EEHZC1E470P Overview

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