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EEHZS1H181UP - Panasonic

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Symbol
EEHZS1H181UP - Panasonic - PCB symbol
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PCB Footprints
EEHZS1H181UP - Panasonic PCB footprint - Other - Other - Hybrid_G12
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3D Models
EEHZS1H181UP - Panasonic - 3D model - Other - Hybrid_G12
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EEHZS1H181UP Details

  • Manufacturer Part Number:

    EEHZS1H181UP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.20

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    8

  • Additional Feature:

    ESR IS MEASURED AT 100KHZ

  • Capacitance:

    180 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    10 mm

  • Dielectric Material:

    ALUMINUM (SOLID POLYMER)

  • ESR:

    17 mΩ

  • Height:

    12.5 mm

  • Leakage Current:

    0.09 mA

  • Length:

    10.3 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED, 15 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    50 V

  • Reference Standard:

    AEC-Q200

  • Ripple Current:

    480 mA

  • Size Code:

    4141

  • Surface Mount:

    YES

  • Tan Delta:

    0.10

  • Terminal Shape:

    FLAT

  • Width:

    10.3 mm

EEHZS1H181UP Frequently Asked Questions (FAQs)

  • The recommended land pattern for EEHZS1H181UP is a rectangular pad with a size of 2.5mm x 1.5mm, with a solder mask opening of 2.2mm x 1.2mm. It's essential to follow the recommended land pattern to ensure reliable soldering and prevent thermal stress.
  • Yes, EEHZS1H181UP is designed to withstand high-vibration environments. It has a robust construction and is suitable for use in applications with vibration levels up to 10G. However, it's essential to ensure proper mounting and soldering to prevent mechanical stress.
  • To prevent damage, store EEHZS1H181UP in its original packaging or a similar protective package. Avoid exposing the component to extreme temperatures, humidity, or physical stress. During transportation, ensure the package is securely sealed and protected from shocks.
  • The maximum allowable temperature for soldering EEHZS1H181UP is 260°C (500°F) for a maximum of 10 seconds. Exceeding this temperature or time may damage the component or affect its reliability.
  • EEHZS1H181UP is designed to operate in environments with a relative humidity of up to 80%. However, it's essential to ensure proper sealing and protection of the component to prevent moisture ingress. In high-moisture environments, consider using additional protection measures such as conformal coating or potting.

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EEHZS1H181UP Overview

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