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- Stock & Prices $ Price & Stock for EEHZU1J101P
- Part Number EEHZU1J101P
- Manufacturer Panasonic
- Pin Count 2
- Part Category Capacitor Polarised
- Package Category Other
- Footprint Name Other - Hybrid_G12
- Released Date Sep 29, 2021
- Last Modified Date Jan 23, 2024 6:27 AM UTC
- Pinout / Pin List Click Here (Member Only)
EEHZU1J101P Details
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Manufacturer Part Number:
EEHZU1J101P
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Japan
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ECCN Code:
EAR99
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Manufacturer:
Panasonic Electronic Components
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YTEOL:
7
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Additional Feature:
ESR IS MEASURED AT 100 KHZ
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Capacitance:
100 µF
EEHZU1J101P Frequently Asked Questions (FAQs)
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The recommended land pattern for EEHZU1J101P can be found in the Panasonic Electronic Components' recommended footprint document or by consulting with a PCB design expert. A general guideline is to follow the IPC-7351 standard for surface-mount components.
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EEHZU1J101P is a moisture-sensitive device. It's essential to follow the recommended storage and handling procedures to prevent moisture absorption. Store the components in a dry environment, and use a dry pack or desiccant to maintain a low humidity level. Follow the MSL (Moisture Sensitivity Level) guidelines for handling and reflow soldering.
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The maximum reflow temperature for EEHZU1J101P is 260°C, with a recommended peak temperature of 250°C. It's essential to follow the recommended reflow profile to prevent damage to the component.
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EEHZU1J101P is designed to withstand moderate vibration levels. However, for high-vibration environments, it's recommended to consult with a mechanical engineer to ensure the component is properly secured and the PCB is designed to withstand the vibration. Additional testing and validation may be required.
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To ensure the reliability of EEHZU1J101P in a high-temperature environment, follow the recommended operating temperature range and derating guidelines. Ensure proper thermal management, such as using a heat sink or thermal interface material, and consider using a thermally conductive adhesive to attach the component to the PCB.
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EEHZU1J101P Overview
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