The recommended land pattern for EEUED2C221 is a rectangular pad with a size of 3.5mm x 2.5mm, with a solder mask opening of 3.1mm x 2.1mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
During reflow soldering, the EEUED2C221 should be placed on the PCB with the capacitor body facing upwards. The recommended reflow profile is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. The component should be cooled down to 100°C within 6 minutes.
The derating curve for EEUED2C221 is not explicitly provided in the datasheet, but it can be estimated based on the temperature coefficient of capacitance. As a general guideline, the capacitance value can be derated by 2-3% per 10°C increase in temperature above 25°C.
Yes, the EEUED2C221 is designed to withstand high-vibration environments. It has a vibration endurance of 10-2000Hz, 1.5mm amplitude, and 3 hours per axis. However, it's recommended to perform additional testing and validation to ensure the component meets the specific requirements of your application.
The MSL of EEUED2C221 is MSL 2, which means it can withstand exposure to moisture for up to 4 days at 30°C and 60% relative humidity. It's recommended to follow the recommended storage and handling procedures to prevent moisture absorption.
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EEUED2C221 Overview
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