The recommended land pattern for EEUFR1J101L is a rectangular pad with a size of 2.5mm x 1.5mm, with a solder mask opening of 2.2mm x 1.2mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
During reflow soldering, the EEUFR1J101L should be placed on the PCB with the component's marking side facing up. The recommended reflow profile is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The component should be cooled down to 180°C within 10 minutes after the peak temperature.
The maximum allowable voltage derating for EEUFR1J101L is 80% of the rated voltage. For example, if the rated voltage is 50V, the maximum allowable voltage derating is 40V.
EEUFR1J101L is rated for operation up to 125°C. However, the component's lifespan and reliability may be affected if it is operated at high temperatures for an extended period. It is recommended to derate the voltage and current ratings according to the temperature derating curve provided in the datasheet.
EEUFR1J101L components should be stored in a dry, cool place away from direct sunlight and moisture. The storage temperature should be between -10°C and 30°C, and the humidity should be below 60%. The components should be stored in their original packaging or in a sealed bag to prevent moisture absorption.
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EEUFR1J101L Overview
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