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EFC2K103NUZTDG - onsemi

Description: Low Rss(on); Small size and narrow width; Low Gate Charge; 2kV ESD HBM; Common-Drain Type; ESD Diode-Protected Gate; RoHS compliance

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EFC2K103NUZTDG - onsemi - PCB symbol
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EFC2K103NUZTDG - onsemi PCB footprint - Other - Other - EFC2K103NUZTDG-1
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EFC2K103NUZTDG - onsemi - 3D model - Other - EFC2K103NUZTDG-1
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EFC2K103NUZTDG Details

  • Manufacturer Part Number:

    EFC2K103NUZTDG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WLCSP10, 3.54x1.77x0.14

  • Manufacturer Package Code:

    567XB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Case Connection:

    SOURCE

  • Configuration:

    COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-XBCC-N10

  • Number of Elements:

    2

  • Number of Terminals:

    10

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    3.3 W

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

EFC2K103NUZTDG Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern is recommended. Refer to the onsemi application note AND9093/D for more details.
  • The device requires a stable input voltage and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network are recommended to ensure a stable input voltage and proper biasing.
  • The device is sensitive to electrostatic discharge (ESD) and can be damaged by excessive voltage or current. Handle the device with an ESD wrist strap or mat, and avoid touching the pins or leads. Use an anti-static bag or tube for storage.
  • Use a thermal imaging camera to detect hotspots, and check for proper thermal design and cooling. Use a logic analyzer or oscilloscope to troubleshoot malfunction issues. Refer to the onsemi application note AND9093/D for troubleshooting guidelines.
  • The EFC2K103NUZTDG meets the onsemi quality and reliability standards, which include AEC-Q101 and ISO/TS 16949 certifications. The device is also RoHS and REACH compliant.

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EFC2K103NUZTDG Overview

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